Ultra-Thin Films

Cerablak® UTF is a dense, hermetic-quality barrier film that provides long-lasting protection for substrates in extreme heat and other harsh environments. Due to the ultra-thin nature of the film, its stability under thermal shock or thermal cycling conditions is excellent despite relatively large thermal mismatch with substrates. Cerablak® UTF can be deposited using dip, spray, flow, and spin processes, and does not require any special surface preparation or pretreatments. Due to the phosphate nature of the material, the adhesion is excellent.

This patented inorganic glassy film is chemically inert and stable at temperatures up to 1400°C and in hazardous environments including oxidizing, reducing, or ultra-high vacuum (UHV) conditions. In addition to surface protection in extreme conditions, Cerablak® UTF also provides unique benefits as an electrically insulating and planarizing layer, well-suited for advancing next generation flexible electronics.

This solution-based, wet deposition process is economical, scalable, and ready to meet the demands of today’s manufacturing requirements.