Flexible insulating substrates used today in electronic components are typically polymers that have limited stability under harsh processing conditions, such as high temperatures and vacuums. Cerablak® insulating coatings on stainless steel foil provide thermally-stable electrical insulation on a flexible substrate and are ready to serve the emerging needs of the electronics industry.

An industry push toward higher-performance devices also means harsher production conditions, including higher temperatures, extreme atmospheres, and tighter tolerances. Despite recent advances in polymer foil, harsh production environments can tax them beyond their limits; thermal decomposition, dimensional instability, water absorption, and outgassing can be monumental hurdles in high-performance flexible electronic and roll-to-roll processing.

ATFI’s proprietary Cerablak® UTF provides planarization and insulation to flexible substrates.  Applied to polished or unpolished stainless steel, substrate roughnesses can be dramatically reduced to R_a levels below 10nm without the complications and costs associated with fine polishing.

The electrically-insulating coating is stable in high vacuum environments and can withstand temperatures above 800°C while providing stable surface roughness and insulation resistance, thus providing an ideal buffer layer for use in CIGS solar modules, displays, next-generation lighting and battery technologies, and other flexible electronics.